Team:Yale/Our Project/Applications

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'''[[Fabrication of Integrated Circuit (under construction!)]]'''

Nano/Micro scale circuits have been instrumental development of new concepts and technologies like the lab-in-a-chip. The wire deposition technique invented by the Yale team can be used to fabricate such circuits by depositing copper wire a substrate in a controlled fashion (Fig 1) [[Image:Example.jpg]]

[[Substrate Preparation]]
This entails creating a mould on a silicon/silicon dioxide substrate using conventional techniques like photolithography or etching.

[[Deposition]]
The mould will be inundated with copper sulphate solution containing the engineered bacteria. The liquid will be withdrawn/pushed out of the channels as the copper is deposited.

[[Integrated Circuit]]
The final product is a copper wire etched on a a substrate that can be processed further to work as a circuit. The case study illustrate how such wires can used to make a micro-sized thermocouple temperature sensor.