Team:Yale/Our Project/Applications


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Revision as of 03:30, 20 October 2010

iGEM Yale

Applications: Micro - Circuits, Structures, and Robots!

We have identified two areas where our deposition method can make progress:
1. Fabrication of Micro Integrated Circuits
2. Fabrication of Micro Mechanical Structures

The robotics case study shows how coverage of both of these areas can lead to assembly of micro-sized robots.

Fabrication of Integrated Circuits (under construction!)

Nano/Micro scale circuits have been instrumental development of new concepts and technologies like the lab-in-a-chip. The wire deposition technique invented by the Yale team can be used to fabricate such circuits by depositing copper wire a substrate in a controlled fashion (Fig 1) [[Image:Example.jpg]]

Substrate Preparation
This entails creating a mould on a silicon/silicon dioxide substrate using conventional techniques like photolithography or etching.

The mould will be inundated with copper sulphate solution containing the engineered bacteria. The liquid will be withdrawn/pushed out of the channels as the copper is deposited.

Integrated Circuit
The final product is a copper wire etched on a a substrate that can be processed further to work as a circuit. The case study illustrate how such wires can used to make a micro-sized thermocouple temperature sensor.