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Team:Yale/Our Project
From 2010.igem.org
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Welcome to Yale-iGEM 2010! In our inaugural year of iGEM competition, we have designed a system to harness biology to construct conductive circuits. | Welcome to Yale-iGEM 2010! In our inaugural year of iGEM competition, we have designed a system to harness biology to construct conductive circuits. | ||
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| - | By enabling E. coli to affect local redox chemistry, we can use bacteria to construct circuit elements in a specified geometry. This could allow the manufacture of electrical components under biological conditions. | + | <b>By enabling <i>E. coli</i> to affect local redox chemistry, we can use bacteria to construct circuit elements in a specified geometry. This could allow the manufacture of electrical components under biological conditions.</b><br/> |
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| + | <b>Fabrication of Integrated Circuits (under construction!)</b><br/> | ||
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| + | Nano/Micro scale circuits have been instrumental development of new concepts and technologies like the lab-in-a-chip. The wire deposition technique invented by the Yale team can be used to fabricate such circuits by depositing copper wire a substrate in a controlled fashion (Fig 1) | ||
| + | [[Image:Example.jpg]]<br/> | ||
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<!------------- INTRODUCTION: NEEDS TO BE EDITED -------------> | <!------------- INTRODUCTION: NEEDS TO BE EDITED -------------> | ||
Revision as of 17:59, 24 October 2010
our project
introduction
Yale-iGEM team is doing great.
Welcome to Yale-iGEM 2010! In our inaugural year of iGEM competition, we have designed a system to harness biology to construct conductive circuits.
By enabling E. coli to affect local redox chemistry, we can use bacteria to construct circuit elements in a specified geometry. This could allow the manufacture of electrical components under biological conditions.
Fabrication of Integrated Circuits (under construction!)
Nano/Micro scale circuits have been instrumental development of new concepts and technologies like the lab-in-a-chip. The wire deposition technique invented by the Yale team can be used to fabricate such circuits by depositing copper wire a substrate in a controlled fashion (Fig 1)
[[Image:Example.jpg]]
