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Team:Yale/Our Project/Applications
From 2010.igem.org
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1. Manufacturing<br/> | 1. Manufacturing<br/> | ||
2. Design<br/> | 2. Design<br/> | ||
| - | + | - Micro Integrated Circuits<br/> | |
| - | + | - Micro Mechanical Structures<br/> | |
<br/> | <br/> | ||
The robotics case study shows how coverage of both of these areas can lead to assembly of micro-sized robots.<br/> | The robotics case study shows how coverage of both of these areas can lead to assembly of micro-sized robots.<br/> | ||
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<b>Fabrication of Integrated Circuits (under construction!)</b><br/> | <b>Fabrication of Integrated Circuits (under construction!)</b><br/> | ||
| - | + | Nano/Micro scale circuits have been instrumental development of new concepts and technologies like the lab-in-a-chip. The wire deposition technique invented by the Yale team can be used to fabricate such circuits by depositing copper wire a substrate in a controlled fashion: | |
| - | Nano/Micro scale circuits have been instrumental development of new concepts and technologies like the lab-in-a-chip. The wire deposition technique invented by the Yale team can be used to fabricate such circuits by depositing copper wire a substrate in a controlled fashion | + | |
[[Image:Example.jpg]]<br/> | [[Image:Example.jpg]]<br/> | ||
<br/> | <br/> | ||
| - | + | <i>Substrate Preparation</i><br/> | |
| - | Substrate Preparation<br/> | + | |
This entails creating a mould on a silicon/silicon dioxide substrate using conventional techniques like photolithography or etching.<br/> | This entails creating a mould on a silicon/silicon dioxide substrate using conventional techniques like photolithography or etching.<br/> | ||
<br/> | <br/> | ||
| - | + | <i>Deposition</i><br/> | |
| - | Deposition<br/> | + | |
The mould will be inundated with copper sulphate solution containing the engineered bacteria. The liquid will be withdrawn/pushed out of the channels as the copper is deposited.<br/> | The mould will be inundated with copper sulphate solution containing the engineered bacteria. The liquid will be withdrawn/pushed out of the channels as the copper is deposited.<br/> | ||
<br/> | <br/> | ||
| - | + | <i>Integrated Circuit</i><br/> | |
| - | Integrated Circuit<br/> | + | |
The final product is a copper wire etched on a a substrate that can be processed further to work as a circuit. The case study illustrate how such wires can used to make a micro-sized thermocouple temperature sensor. <br/> | The final product is a copper wire etched on a a substrate that can be processed further to work as a circuit. The case study illustrate how such wires can used to make a micro-sized thermocouple temperature sensor. <br/> | ||
<br/> | <br/> | ||
| - | <b>Fabrication of Micro Mechanical Structures</b><br/> | + | <b>Fabrication of Micro Mechanical Structures</b><br/> |
| - | + | A similar approach can be used to make micro metallic structures. Complex moulds can be made using conventional manipulation techniques and deposited with metal. This approach allows for some degree of mass production as the same mould can be used to fabricate multiple parts unlike other common methods. For instance the commonly used Atomic Force Microscopy probe that ac pull, push, and indent surfaces to assemble nano/micro structures, does not allow to visualize the object and manipulate it at the same time, so requires a series of ‘look and move’ operations that make manipulation cumbersome.</br> | |
| - | A similar approach can be used to make micro metallic structures. Complex moulds can be made using conventional manipulation techniques and deposited with metal. This approach allows for some degree of mass production as the same mould can be used to multiple parts unlike other common methods. For instance | + | </br> |
A mould based system can simplify/eliminate the need for such manipulation by constraining deposition to the space inundated by the growth solution. This approach also allows for formation of complex geometries. However, this strategy requires efficient mould-part separation techniques (expand). | A mould based system can simplify/eliminate the need for such manipulation by constraining deposition to the space inundated by the growth solution. This approach also allows for formation of complex geometries. However, this strategy requires efficient mould-part separation techniques (expand). | ||
<br/> | <br/> | ||
Revision as of 19:40, 24 October 2010
our project
Applications: Micro - Circuits, Structures, and Robots!
We have identified two areas where our deposition method can make progress:
1. Manufacturing
2. Design
- Micro Integrated Circuits
- Micro Mechanical Structures
The robotics case study shows how coverage of both of these areas can lead to assembly of micro-sized robots.
Fabrication of Integrated Circuits (under construction!)
Nano/Micro scale circuits have been instrumental development of new concepts and technologies like the lab-in-a-chip. The wire deposition technique invented by the Yale team can be used to fabricate such circuits by depositing copper wire a substrate in a controlled fashion:
[[Image:Example.jpg]]
Substrate Preparation
This entails creating a mould on a silicon/silicon dioxide substrate using conventional techniques like photolithography or etching.
Deposition
The mould will be inundated with copper sulphate solution containing the engineered bacteria. The liquid will be withdrawn/pushed out of the channels as the copper is deposited.
Integrated Circuit
The final product is a copper wire etched on a a substrate that can be processed further to work as a circuit. The case study illustrate how such wires can used to make a micro-sized thermocouple temperature sensor.
Fabrication of Micro Mechanical Structures
A similar approach can be used to make micro metallic structures. Complex moulds can be made using conventional manipulation techniques and deposited with metal. This approach allows for some degree of mass production as the same mould can be used to fabricate multiple parts unlike other common methods. For instance the commonly used Atomic Force Microscopy probe that ac pull, push, and indent surfaces to assemble nano/micro structures, does not allow to visualize the object and manipulate it at the same time, so requires a series of ‘look and move’ operations that make manipulation cumbersome.
A mould based system can simplify/eliminate the need for such manipulation by constraining deposition to the space inundated by the growth solution. This approach also allows for formation of complex geometries. However, this strategy requires efficient mould-part separation techniques (expand).
Applications Case Study: Microbots
