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Team:Yale/Our Project/Applications
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<li><a href="https://2010.igem.org/Team:Yale/Our Project/Future Work">future work</a></li> | <li><a href="https://2010.igem.org/Team:Yale/Our Project/Future Work">future work</a></li> | ||
| - | <li><a href="https://2010.igem.org/Team:Yale/Our Project/Applications">applications</a></li> | + | <li><b><a href="https://2010.igem.org/Team:Yale/Our Project/Applications">applications</a></b></li> |
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Revision as of 03:30, 20 October 2010
our project
Applications: Micro - Circuits, Structures, and Robots!
We have identified two areas where our deposition method can make progress:
1. Fabrication of Micro Integrated Circuits
2. Fabrication of Micro Mechanical Structures
The robotics case study shows how coverage of both of these areas can lead to assembly of micro-sized robots.
Fabrication of Integrated Circuits (under construction!)
Nano/Micro scale circuits have been instrumental development of new concepts and technologies like the lab-in-a-chip. The wire deposition technique invented by the Yale team can be used to fabricate such circuits by depositing copper wire a substrate in a controlled fashion (Fig 1)
[[Image:Example.jpg]]
Substrate Preparation
This entails creating a mould on a silicon/silicon dioxide substrate using conventional techniques like photolithography or etching.
Deposition
The mould will be inundated with copper sulphate solution containing the engineered bacteria. The liquid will be withdrawn/pushed out of the channels as the copper is deposited.
Integrated Circuit
The final product is a copper wire etched on a a substrate that can be processed further to work as a circuit. The case study illustrate how such wires can used to make a micro-sized thermocouple temperature sensor.
