Team:Yale/Our Project/Applications

From 2010.igem.org

(Difference between revisions)
Line 21: Line 21:
<div id="right-col">
<div id="right-col">
<h5>
<h5>
-
applications
+
Applications: Micro - Circuits, Structures, and Robots!
</h5>
</h5>
<p>
<p>
<!------------- APPLICATIONS: NEEDS TO BE EDITED------------->
<!------------- APPLICATIONS: NEEDS TO BE EDITED------------->
-
'''[[Fabrication of Integrated Circuit (under construction!)]]'''<br/>
+
<b>Fabrication of Integrated Circuit (under construction!)</b><br/>
<br/>
<br/>
Nano/Micro scale circuits have been instrumental development of new concepts and technologies like the lab-in-a-chip. The wire deposition technique invented by the Yale team can be used to fabricate such circuits by depositing copper wire a substrate in a controlled fashion (Fig 1)
Nano/Micro scale circuits have been instrumental development of new concepts and technologies like the lab-in-a-chip. The wire deposition technique invented by the Yale team can be used to fabricate such circuits by depositing copper wire a substrate in a controlled fashion (Fig 1)
Line 32: Line 32:
<br/>
<br/>
-
[[Substrate Preparation]]<br/>
+
Substrate Preparation<br/>
This entails creating a mould on a silicon/silicon dioxide substrate using conventional techniques like photolithography or etching.<br/>
This entails creating a mould on a silicon/silicon dioxide substrate using conventional techniques like photolithography or etching.<br/>
<br/>
<br/>
-
[[Deposition]]<br/>
+
Deposition<br/>
The mould will be inundated with copper sulphate solution containing the engineered bacteria. The liquid will be withdrawn/pushed out of the channels as the copper is deposited.<br/>
The mould will be inundated with copper sulphate solution containing the engineered bacteria. The liquid will be withdrawn/pushed out of the channels as the copper is deposited.<br/>
<br/>
<br/>
-
[[Integrated Circuit]]<br/>
+
Integrated Circuit<br/>
The final product is a copper wire etched on a a substrate that can be processed further to work as a circuit. The case study illustrate how such wires can used to make a micro-sized thermocouple temperature sensor. <br/>  
The final product is a copper wire etched on a a substrate that can be processed further to work as a circuit. The case study illustrate how such wires can used to make a micro-sized thermocouple temperature sensor. <br/>  

Revision as of 01:50, 20 October 2010

iGEM Yale

Applications: Micro - Circuits, Structures, and Robots!

Fabrication of Integrated Circuit (under construction!)

Nano/Micro scale circuits have been instrumental development of new concepts and technologies like the lab-in-a-chip. The wire deposition technique invented by the Yale team can be used to fabricate such circuits by depositing copper wire a substrate in a controlled fashion (Fig 1) [[Image:Example.jpg]]

Substrate Preparation
This entails creating a mould on a silicon/silicon dioxide substrate using conventional techniques like photolithography or etching.

Deposition
The mould will be inundated with copper sulphate solution containing the engineered bacteria. The liquid will be withdrawn/pushed out of the channels as the copper is deposited.

Integrated Circuit
The final product is a copper wire etched on a a substrate that can be processed further to work as a circuit. The case study illustrate how such wires can used to make a micro-sized thermocouple temperature sensor.