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Team:Yale/Our Project/Applications
From 2010.igem.org
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<!------------- APPLICATIONS: NEEDS TO BE EDITED-------------> | <!------------- APPLICATIONS: NEEDS TO BE EDITED-------------> | ||
| - | + | '''[[Fabrication of Integrated Circuit (under construction!)]]'''<br/> | |
| + | <br/> | ||
| + | Nano/Micro scale circuits have been instrumental development of new concepts and technologies like the lab-in-a-chip. The wire deposition technique invented by the Yale team can be used to fabricate such circuits by depositing copper wire a substrate in a controlled fashion (Fig 1) | ||
| + | [[Image:Example.jpg]]<br/> | ||
| + | <br/> | ||
| + | |||
| + | [[Substrate Preparation]]<br/> | ||
| + | This entails creating a mould on a silicon/silicon dioxide substrate using conventional techniques like photolithography or etching.<br/> | ||
| + | <br/> | ||
| + | |||
| + | [[Deposition]]<br/> | ||
| + | The mould will be inundated with copper sulphate solution containing the engineered bacteria. The liquid will be withdrawn/pushed out of the channels as the copper is deposited.<br/> | ||
| + | <br/> | ||
| + | [[Integrated Circuit]]<br/> | ||
| + | The final product is a copper wire etched on a a substrate that can be processed further to work as a circuit. The case study illustrate how such wires can used to make a micro-sized thermocouple temperature sensor. <br/> | ||
| + | |||
<!------------- APPLICATIONS: NEEDS TO BE EDITED -------------> | <!------------- APPLICATIONS: NEEDS TO BE EDITED -------------> | ||
Revision as of 01:44, 20 October 2010
our project
applications
'''[[Fabrication of Integrated Circuit (under construction!)]]'''
Nano/Micro scale circuits have been instrumental development of new concepts and technologies like the lab-in-a-chip. The wire deposition technique invented by the Yale team can be used to fabricate such circuits by depositing copper wire a substrate in a controlled fashion (Fig 1)
[[Image:Example.jpg]]
[[Substrate Preparation]]
This entails creating a mould on a silicon/silicon dioxide substrate using conventional techniques like photolithography or etching.
[[Deposition]]
The mould will be inundated with copper sulphate solution containing the engineered bacteria. The liquid will be withdrawn/pushed out of the channels as the copper is deposited.
[[Integrated Circuit]]
The final product is a copper wire etched on a a substrate that can be processed further to work as a circuit. The case study illustrate how such wires can used to make a micro-sized thermocouple temperature sensor.
